Semiconductors

Micron will provide $500m to GlobalWafers' Texas wafer plant and sign a 10-year supply deal, anchoring a broader $3bn domestic investment programme.

French epitaxy equipment maker RIBER has secured a new order from photonics firm 3SP Technologies for an industrial passivation platform, due for delivery in 2027.

ASUS has listed its new ExpertBook P5 G2 and B5 G2 business laptops in the US, priced from $2,630 with Copilot+-ready NPU silicon.

Himax Technologies is selling its 31% holding in an unnamed semiconductor startup for a share of an $80m cash acquisition, expected to close in Q4

UC Investments leads the round as Qolab targets fault-tolerant quantum computing via semiconductor manufacturing partnerships.

French AI inference chipmaker VSORA has closed a funding round led by Ardian, with a larger Series planned for 2027 to fund international expansion.

The Los Angeles advanced materials startup emerged from stealth with $8m seed funding led by Initialized Capital to commercialise carbon-nanomaterial-infused metals.

Himax's new HE Series ICs bring hardware-accelerated 3D depth sensing to robotics, industrial automation and AIoT, with OFILM already shipping a product.

The NASDAQ-listed photonics firm set out a production ramp, $50m capex deployment and over $100m in active customer pipeline at its 2026 AGM.

The NASDAQ-listed firm said 16 B300 AI servers, due in Q3 2026, are expected to generate $360,000 in monthly recurring revenue from contracted

Soitec will supply Power-SOI substrates to China's ZenSemi as the pair target high-volume 300mm BCD-on-SOI wafers for AI, automotive and

Wooptix has deployed its Phemet wafer metrology platform at CEA-Leti's Grenoble cleanroom to validate the tool for high-volume semiconductor manufacturing.

CBAK Energy has unveiled two next-generation LFP cylindrical cells targeting battery backup and UPS applications in GPU-dense AI data centres.

NVIDIA beat Q1 expectations with 85% year-on-year revenue growth and announced an $80bn share buyback alongside Q2 guidance of $91bn.

Acer's new Windows 11 gaming handheld pairs Intel Arc G3 Extreme silicon with a dual-fan cooling system, targeting a Middle East and Africa

Applied Materials has unveiled seven new chipmaking systems targeting DRAM transistor scaling and advanced 3D packaging for next-generation AI chips.

Cerebras Systems reported 94% year-on-year revenue growth in Q1 2026, buoyed by a $20bn OpenAI compute deal and a $6.4bn IPO.

Micron's fiscal Q3 2026 revenue rose 346% year-on-year, driven by AI-related demand for HBM and data-centre memory products.

STMicroelectronics has introduced the ST54M, a single-die secure mobile chip integrating a post-quantum cryptography hardware accelerator alongside NFC, eSIM and

Micron has joined Anthropic's Series H round and signed a multi-year memory and storage supply agreement to support Claude's growing compute demands.