Semiconductors

The semiconductor and edge-platform vendors say their partnership lets enterprises deploy and manage AI models on Ambarella SoCs from a single cloud control plane.

Ambarella's X7 brings its third-generation CVflow engine to existing Arm and x86 systems via PCIe or USB, targeting retrofit edge AI deployments.

Seagate's inaugural Data Infrastructure Readiness Report finds only 38% of organisations feel fully prepared for AI-driven storage growth.

DeepSeek's memory-lean V4.1 Flash model rattled chipmaker stocks as Z.AI raised $5bn to build AI that trains itself.

Exascale Labs and Compal Electronics have signed a letter of intent to jointly develop a US-based 800-volt DC validation platform for next-generation

The Taiwanese fabless chip maker will exhibit its TDDI, OLED and multi-output Tcon portfolio alongside live 3D sensing demos at the SID Vehicle Displays

Microchip Technology's SY757xx family targets voltage-translation challenges in AI accelerators, FPGAs and next-generation SoC platforms.

Liberty Global Tech Ventures joins an oversubscribed $875m round backing Positron AI's LPDDR5X-based inference hardware, valuing the startup at $5bn.

PDF Solutions has launched Exensio Aurora, a redesigned analytics architecture targeting petabyte-scale semiconductor manufacturing data and agentic AI deployment.

Atsign and Intel have published benchmarks showing up to 88x faster encrypted agent-to-agent communications using Intel hardware acceleration, targeting smart transport.

ASML has begun construction of a second industrial campus in the Brainport region, with phase one targeting at least 3,000 employees by 2029.

The Cambridge-based flexible-semiconductor maker has appointed Dr Paul James, a 25-year industry veteran, to lead manufacturing and operations at its North East

GF and Monolithic Power Systems will deploy MPS process technology at GF's Singapore 300mm fab, targeting capacity expansion from early 2027.

The NASDAQ-listed US manufacturer will gain its first EU production base for tungsten and molybdenum, with closing expected in Q1 2027.

Himax's HX83196/HX83197 series integrates touch, display driver and eDP interface in a single chip, supporting automotive screens up to 30 inches at 6K

Rigetti Computing has signed a $100m CHIPS Act agreement with the US Department of Commerce to scale superconducting quantum hardware.

The two semiconductor giants are targeting a 12-inch mask pilot line by 2031, with full High NA EUV production readiness set for 2033.

The US foundry has finalised a five-year, milestone-linked award from the Department of Commerce to scale domestic quantum semiconductor manufacturing.

ASM International plans to put former Infineon COO Rutger Wijburg before shareholders for Supervisory Board approval at an EGM in early March 2027.

Ambarella's Q2 FY2027 revenue hit $108.1m, up 13% year-on-year, driven by its 5nm CV75 and CV72 AI chips for automotive and